Every field carries the source the pipeline used and its nominal confidence. “—” means honestly unknown, never guessed.
| Field | Value | Source | Confidence |
|---|---|---|---|
| Series | x13s | mtm | high |
| Generation | 1 | mtm | high |
| CPU | — | — | — |
| CPU (partial) | snapdragon8cx:snapdragon-8cx | inferred | high |
| RAM | 16 | itemspecifics | high |
| Storage | 512 | itemspecifics | high |
| GPU | Qualcomm Adreno 690 | itemspecifics | high |
| Graphics type | integrated | itemspecifics | high |
| Display | 1920x1200 | itemspecifics | high |
| Release year | 2022 | inferred | high |
| BIOS | — | — | — |
| Condition grade | used | platform | high |
First observation. Price changes appear here as they are seen.
| Processor | Snapdragon 8cx Gen 3 |
| Screen Size | 13.3 in |
| Graphics Processing Type | Integrated/On-Board Graphics |
| RAM Size | 16 GB |
| Color | Black |
| MPN | ThinkPad X13s Gen 1 |
| SSD Capacity | 512 GB |
| GPU | Qualcomm Adreno 690 |
| Processor Speed | 3.00 GHz |
| Brand | Lenovo |
| Series | ThinkPad |
| Type | Notebook/Laptop |
| Maximum Resolution | 1920 x 1200 |
| Model | Lenovo X13s Gen 1 |
| Connectivity | USB-C |
| Hard Drive Capacity | 512 GB |
| Features | 5G, Built-in Webcam, Bluetooth, Wi-Fi, Touchscreen |
| Charger Included | Yes |
| Operating System | Windows 11 Pro |
| Storage Type | SSD (Solid State Drive) |
| Country of Origin | China |
Model : ThinkPad X13s Gen 1. Processor : Qualcomm Snapdragon 8cx Gen 3. Built for working away from a desk. It runs Windows 11 Pro on Arm, and the 13.4 mm chassis has passed MIL-STD-810H military testing. Built for working away from a desk. A Snapdragon X55 5G modem and a built-in eSIM get this ThinkPad online on a mobile data plan, with no tethering and no hunting for Wi-Fi. The 13.3-inch 16:10 touchscreen gives noticeably more vertical room for documents, spreadsheets and code than a 16:9 panel of the same width, and the anti-glare finish keeps reflections down. It runs Windows 11 Pro on Arm, and the 13.4 mm chassis has passed MIL-STD-810H military testing. A Lenovo 65W USB-C AC adapter is included. Specifications Brand : Lenovo Model : ThinkPad X13s Gen 1 Machine Type Model : 21BYS03Y00 Type Number : 21BY Operating System : Windows 11 Pro (on ARM) Processor : Qualcomm Snapdragon 8cx Gen 3 Cores : 4x Kryo Prime + 4x Kryo Gold, 8 threads Max Frequency : Kryo Prime / Gold @3.0GHz Cache : 1MB L2 for Prime core + 512KB L2 for Gold Core Graphics : Qualcomm Adreno 690 GPU, integrated, DirectX 12 NPU : Integrated Qualcomm Hexagon NPU, up to 15 TOPS Memory : 16GB soldered memory, not upgradable Memory Type : LPDDR4x-4266 Memory Slots : Memory soldered to systemboard, no slots, dual-channel Storage : 512GB M.2 2242 SSD Storage Interface : PCIe NVMe Storage Security : Opal 2.0 Card Reader : No card reader Display : 13.3" WUXGA (1920x1200), multi-touch, IPS, 300nits, anti-glare Aspect Ratio : 16:10 Contrast Ratio : 1000:1 Color Gamut : 72% NTSC Viewing Angle : 85 / 85 / 85 / 85 degrees Touchscreen : On-cell multi-touch, supports 10-point touch Monitor Support : Supports up to 3 independent displays (native display and 2 external monitors via USB-C); USB-C supports up to 5K@60Hz Camera : 5.0MP, with E-shutter, MIPI, fixed focus Audio Chip : High Definition (HD) Audio, Qualcomm WCD9385 codec Speakers : Stereo speakers, 2W x2, Dolby Audio Microphone : Triple-microphone array, far-field Keyboard : 6-row, spill-resistant, multimedia Fn keys with Unified Communications controls Keyboard Backlight : LED backlight UltraNav : TrackPoint pointing device and glass-like Mylar surface multi-touch touchpad, 56 x 115 mm (2.24 x 4.53 inches) WLAN + Bluetooth : Qualcomm Wi-Fi 6E WCN6855, 802.11ax Dual Band 2x2 Wi-Fi + Bluetooth 5.1 (Bluetooth 5.2 hardware ready) WWAN : Qualcomm Snapdragon X55 5G Modem-RF System, Sub-6 GHz, M.2 card, with embedded eSIM functionality SIM Card : 1x Nano-SIM card slot Ethernet : No onboard Ethernet NFC : No support Audio Port : 1x Headphone / microphone combo jack (3.5mm) USB Ports : 2x USB-C 3.2 Gen 2 (support data transfer, Power Delivery 3.0 and DisplayPort 1.4a) Docking : Various docking solutions supported via USB-C Security Chip : Discrete TPM 2.0 (TCG certified, FIPS 140-2 certified) and Microsoft Pluton TPM 2.0, one enabled at one time Fingerprint Reader : Touch style fingerprint reader integrated in power button, match-on-chip Physical Lock : Kensington Nano Security Slot, 2.5 x 6 mm BIOS Security : Supervisor password, power-on password, system management password, self-healing BIOS Battery : Integrated Li-Polymer 49.5Wh battery Power Adapter : 65W USB-C AC adapter, supports PD 3.0, 100-240V, 50-60Hz Power Adapter Part Number : SA10R17025 Dimensions (WxDxH) : 298.7 x 206.4 x 13.4 mm (11.76 x 8.13 x 0.53 inches) Weight : Starting at 1.06 kg (2.35 lbs) Case Color : Thunder black Case Material : Magnesium-aluminium (top), GFRP (bottom) Durability : MIL-STD-810H military test passed